Researchers at ETH Zürich and New York University published a technical paper titled “Understanding the Power Consumption of ...

Fab expansion accelerates; China advances memory and EUV; Teradyne's test deal; SEMICON West and OCP highlights; 3D SiP; TSMC and ASML signals; 300mm fab spending; optical and 3D-compute startups ...

Plus, agentic EDA and AI-generated analog layout, small chip fabs, diamond-based defect inspection, large-area nanoimprint ...

The shift-left approach to via optimization involves a specialized enhancement platform that operates on the design database ...

Increasing complexity requires thermal, electrical, and mechanical effects to be analyzed together. Complex designs now ...

Champaign, National Energy Technology Laboratory, Argonne National Laboratory, and Monash University published a technical ...

Open interfaces and interoperability allow designers to choose technologies based on the needs of the system. AI ...

Synopsys CEO Sassine Ghazi talks about AI agents, the limits of autonomous engineering, digital twins, and the challenges ...

Because in the age of AI, performance is no longer determined by a single chip itself. It is shaped by how efficiently the ...

Closing the visibility gap looks different as a result. The goal isn’t one test, model, sensor, or inspection system that somehow sees everything. It’s getting better at recognizing what each view can ...

Agentic workloads increase CPU demand, while reasoning models, MoE architectures, and reservoir computing fuel AI acceleration.

Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the ...